About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
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Symposium
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Heterostructured and Gradient Materials (HGM V): New Mechanistic Discoveries Enabling Superior Properties
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Presentation Title |
In Situ Pillar Compression to Understand Dislocation-grain Boundary Interactions in Cu |
Author(s) |
Nan Li, Dongyue Xie, Muh-Jang Chen, Mohammed Zikry, Darby Luscher, Abigail Hunter, Saryu Fensin |
On-Site Speaker (Planned) |
Saryu Fensin |
Abstract Scope |
Grain boundary is one of the most important planar defects in materials. Correlated mechanical response leads to localized strain accumulation and structural evolution. This can determine whether dislocations can nucleate, transmit, or just be blocked at the boundary. In order to understand this process, we have performed in situ pillar compression in a scanning electron microscope coupled with electron backscatter diffraction scanning. The bicrystalline pillars, with the chosen boundary in the middle, are prepared in a shape of rectangular cuboid. Depending on the boundary structure, various interactions with dislocations at the boundary are captured. Correlated with the electron backscatter diffraction mapping at different strain states, we are able to quantify the lattice rotation and local strain tensor along the loading axial. Such information has helped us to better understand the mechanical role of grain boundaries and provided a unique validation for the modeling at both atomic and mesoscales. |
Proceedings Inclusion? |
Planned: |
Keywords |
Mechanical Properties, Copper / Nickel / Cobalt, Characterization |