| About this Abstract |
| Meeting |
2023 TMS Annual Meeting & Exhibition
|
| Symposium
|
Heterostructured and Gradient Materials (HGM V): New Mechanistic Discoveries Enabling Superior Properties
|
| Presentation Title |
Strengthening of 3D Printed Cu Micropillar in Cu-Ni Core-shell Structure |
| Author(s) |
Manish Jain, Amit Sharma, Patrik Schürch, Nicolo Maria Della Ventura, Wabe Koelmans, Xavier Maeder, Jakob Schwiedrzik, Johann Michler |
| On-Site Speaker (Planned) |
Manish Jain |
| Abstract Scope |
In this work, we demonstrate a unique Copper-Nickel (Cu-Ni) core-shell structure for improved strength, while maintaining the shape of 3D printed Cu. An additive micromanufacturing technique based on localized electrodeposition, with a submicron spatial resolution, was utilized to fabricate micropillar-shaped Cu cores. These cores were subsequently coated by pulse reverse electrodeposition with Ni of two different thicknesses: 250nm and 670nm. A combination of in-situ micropillar compression and finite element (FE) simulation demonstrated a remarkable strengthening (~3 times) of the Ni coated Cu micropillar. Transmission Kikuchi diffraction and transmission electron microscopy were utilized to study the microstructure before and after deformation. Data obtained from both experiments and FE simulation were in good agreement suggesting the strengthening depends on the combination of interface characteristics, stress distribution and geometrical effects. The findings of this work can be extended to other material systems and provide a pathway to develop stronger composites for future applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Mechanical Properties, Surface Modification and Coatings, Characterization |