About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
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Heterostructured and Gradient Materials (HGM V): New Mechanistic Discoveries Enabling Superior Properties
|
Presentation Title |
Modeling of Back Stresses in Additively Manufactured Stainless Steel |
Author(s) |
Kunqing Ding, Yin Zhang, David L. McDowell, Ting Zhu |
On-Site Speaker (Planned) |
Kunqing Ding |
Abstract Scope |
Additively manufactured stainless steel exhibits high yield strength and strain hardening due to printing-induced sub-micron dislocation cell structures. The as-printed dislocation cells hinder dislocation glide during plastic deformation, producing strong back stresses. We develop models of microscale internal stresses in AM stainless steel by focusing on their back stress components. Three sources of back stresses are considered, including the printing and deformation-induced back stresses associated with as-printed dislocation cells as well as the deformation-induced back stresses associated with grain boundaries. A dislocation pile-up model is adopted to evaluate the deformation-induced back stresses associated with as-printed dislocation cells. The extracted back stress relation from the pile-up model is incorporated into a crystal plasticity model. The associated finite element simulation results agree with the experimentally measured back stress and tension-compression asymmetry. Our results provide an in-depth understanding of the origins and evolution of back stresses in AM metallic materials. |
Proceedings Inclusion? |
Planned: |
Keywords |
High-Entropy Alloys, Modeling and Simulation, Additive Manufacturing |