|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Grain Boundaries and Interfaces: Metastability, Disorder, and Non-Equilibrium Behavior
||Thermal Stability and Mechanical Behavior of Immiscible Cu-Ag/Fe Triphase Multilayers with Triple Junctions
||Tongjun Niu, Yifan Zhang, Jaehun Cho, Nicholas Richter, Tianyi Sun, Haiyan Wang, Xinghang Zhang
|On-Site Speaker (Planned)
Multilayers often suffer from high temperature microstructure instability due to thermal grooving and subsequent layer pinch-off. Here we report on the enhanced thermal stability of immiscible triphase Cu-Ag/Fe multilayer with triple junctions comparing to Cu/Fe multilayers. The Cu/Fe multilayers experienced drastic grooving and rapid grain growth at 500 °C, followed by the complete breakdown of layer structure and spheroidization at 600 °C. In comparison, the layer structures of Cu-Ag/Fe multilayers remain stable up to 600°C with insignificant grain coarsening. A modified Mullins model was used to estimate the grooving kinetics, and the underlying mechanisms leading to the excellent thermal stability of the triphase multilayers are discussed. The mechanical response of Cu-Ag/Fe and Cu/Fe multilayer was further investigated using in-situ micropillar compressions tests. Comparing to Cu/Fe multilayer, Cu-Ag/Fe multilayer exhibited higher strength and better work hardening capability, where triphase triple junctions may play substantial role in engaging dislocations.
||Thin Films and Interfaces, Composites, Characterization