|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Grain Boundaries and Interfaces: Metastability, Disorder, and Non-Equilibrium Behavior
||Investigating Factors that Influence Stress-induced Grain Boundary Migration in Ultrafine-grained Metal Thin Films
||Sandra Stangebye, Yin Zhang, Ting Zhu, Olivier Pierron, Josh Kacher
|On-Site Speaker (Planned)
Grain boundaries play an increasingly important role in the deformation of ultrafine-grained (ufg) and nanocrystalline (nc) metals and are key to understanding and improving their mechanical properties. As grain size decreases, conventional dislocation glide is restricted and grain boundaries participate directly in deformation via grain boundary migration. In this talk, I will discuss results combining quantitative in situ transmission electron deformation experiments with orientation mapping in ufg Au thin films. This approach facilitates direct correlation of grain boundary migration behavior with a range of microstructure factors, including grain boundary misorientation/axis of rotation, CSL-number, grain size, Schmid/Taylor factor, etc. These factors were analyzed for hundreds of grain boundaries and correlated to the boundary migration behavior to establish which factors dictate grain boundary stability. Atomistic and finite element simulations were also conducted to provide an in-depth view on how the local stress state and grain boundary structure affects boundary migration behavior.
||Mechanical Properties, Characterization, Modeling and Simulation