|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Grain Boundaries and Interfaces: Metastability, Disorder, and Non-Equilibrium Behavior
||G-31: The Effect of Grain Boundaries on High-temperature Microstructure Evolution in Cu/Nb Composites
||Emmeline Sheu, Jon Kevin Baldwin, Michael J. Demkowicz
|On-Site Speaker (Planned)
We investigate the mechanisms of high temperature microstructure evolution in Cu/Nb composites using a combination of experiments and simulations. To that end, we synthesize specialized, model samples consisting of a Cu layer embedded between two thicker Nb layers. The Cu layer terminates along a straight edge within the composite. Contrary to initial expectations, this edge does not coarsen or retract upon high temperature annealing. Phase field modeling shows that the stability of the terminating edge of the Cu layer is due to anchoring by grain boundaries in the neighboring Nb layers. This work advances understanding of microstructure evolution in two-phase metal composites, enabling improved predictions of their performance at elevated temperatures.