About this Abstract |
Meeting |
2021 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2021)
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Symposium
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Applications
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Presentation Title |
Design and Hybrid Additive Manufacturing for Electronic Components that Can Withstand Shock Loading |
Author(s) |
Connor Gunsbury, Desiderio Kovar, Carolyn Seepersad, Michael Gammage |
On-Site Speaker (Planned) |
Connor Gunsbury |
Abstract Scope |
Direct-write and aerosol deposition processes are well suited for additively manufacturing high value custom electronics in low quantities. These electronics may require shielding from shock loading. Bistable negative stiffness elements (NSEs) that are produced by direct metal laser sintering (DMLS) have been shown to be effective in mitigating shock loading. In this work, we explore a hybrid manufacturing approach utilizing aerosol deposition (AD) to write electronic components onto NSEs. In NSEs, concentric curved beam structures dissipate mechanical energy through elastic buckling, and “snap through” at a force threshold that is dependent on beam geometry and material properties, which reduces transmitted acceleration by orders of magnitude. Using AD, tin dioxide and silver films are deposited onto an ABS substrate to form a resistive circuit. The circuit is mounted to a bistable NSE to create a component that can withstand an extremely high-G mechanical shock. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |