| About this Abstract |
| Meeting |
13th International Conference on the Technology of Plasticity (ICTP 2020)
|
| Symposium
|
13th International Conference on the Technology of Plasticity (ICTP 2020)
|
| Presentation Title |
Springback Prediction in Microbending Process of Pure Copper Foils Using Modified Material Intrinsic Length in Material Model |
| Author(s) |
Mandeep Singh, Dongbin Wei, G.L Samuel |
| On-Site Speaker (Planned) |
Dongbin Wei |
| Abstract Scope |
The study of springback characteristics of different materials foils with different thicknesses is essential to understand the influence of size effects in micro forming. The classical plasticity model cannot explain the size effects since their constitutive laws possess no material intrinsic length. In this study, a combined constitutive model simultaneously considering both the grain size and stain gradient is proposed. The modified material intrinsic length related to the average number of grains in the thickness direction is adopted. The proposed model is implemented to calculate the springback angle in pure copper foils after micro V-bending process. The calculations made by the proposed modified material intrinsic length agree well with the experimental data, while those predicted by the conventional material intrinsic length cannot capture such size effects. The reported results provide an in-depth understanding of the strain gradient size effect influence on the springback behaviour in micro bending of metallic materials. |
| Proceedings Inclusion? |
Definite: At-meeting proceedings |