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Meeting MS&T21: Materials Science & Technology
Symposium Research Lightning Talks
Presentation Title Direct Ink Writing with Highly Loaded Aqueous Silicon Carbide Suspensions
Author(s) Tess D. Marconie, Kyle R Cox, Jeffrey P Youngblood, Rodney W Trice
On-Site Speaker (Planned) Tess D. Marconie
Abstract Scope Silicon carbide (SiC) is a material of interest for many applications due to its good mechanical properties, oxidation resistance, and high thermal conductivity. Colloidal processing and pressureless sintering can enable forming of complex shaped, dense SiC parts. Direct ink writing (DIW) is a colloidal processing technique where ceramic suspensions are extruded through a nozzle along a path, building up a part layer-by-layer. Ceramic suspensions appropriate for DIW must exhibit shear thinning behavior for extrusion, have a yield stress to retain their shape after extrusion, and have a high particle loading to reduce drying defects. In this work, highly loaded (>50% by volume) aqueous SiC suspensions are developed using small amounts (<5% by volume) of polyethylenimine and polyvinylpyrrolidone additives. The effect of particle loading and polyvinylpyrrolidone amount on the rheological properties and print quality are determined. Density, microstructure, and mechanical properties of direct ink written, pressurelessly sintered SiC will be presented.

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

Direct Ink Writing with Highly Loaded Aqueous Silicon Carbide Suspensions
Germanium Photodiodes for Capture of High Energy X-rays
Joining of Silicon Carbide for High-temperature Applications
Mechanical behavior of bonded-PDMS for biological payloads in microgravity
Perfecting Steel Processing in the 21st Century
Refractories for the Food Industry
Superalloy Development for Specific Applications: A Low CTE Alloy
Using Unsupervised Learning to Understand Thin Film Growth
Will Low-cost Ceramic Water Filters Really Work?

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