| About this Abstract |
| Meeting |
13th International Conference on the Technology of Plasticity (ICTP 2020)
|
| Symposium
|
13th International Conference on the Technology of Plasticity (ICTP 2020)
|
| Presentation Title |
Microscale Pattern Replication in Aluminum: Mechanical Response and Incomplete Die Filling in a Double-punch Molding Configuration |
| Author(s) |
Bin Zhang, Mohammad S. Dodaran, Shuai Shao, J. Choi, Sunggook Park, Wen Jin Meng |
| On-Site Speaker (Planned) |
Wen Jin Meng |
| Abstract Scope |
Direct replication of nano-/micro- scale patterns onto metal surfaces by compression molding with patterned dies is used to fabricate metal-based nano/micro systems. Micron scale plasticity governs both the molding response and the geometric fidelity of replicated patterns. Molding at nano/micro scales offers a technologically relevant example in which various plasticity size effects manifest themselves.
Microscale compression molding of single crystal Al was studied by combining experimentation, conventional and strain gradient plasticity finite element simulations. Single rectangular punches with different widths and lengths were used, as well as two identically-dimensioned rectangular punches with a spacing in between. Under double punch molding, both the characteristic molding pressure and gap filling between the two rectangular punches exhibited a significant dependence on the spacing to punch-width ratio, and on the absolute spacing when this ratio was fixed. Our study elucidates the impact of plasticity size effects on molding replication at the micron scale. |
| Proceedings Inclusion? |
Definite: At-meeting proceedings |