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Meeting Materials Science & Technology 2020
Symposium Grain Boundaries, Interfaces, and Surfaces in Functional Materials: Fundamental Structure-Property-Performance Relationships
Presentation Title A Survey of Constrained Grain Boundary Migration Mechanisms
Author(s) Ian Chesser, Elizabeth Holm
On-Site Speaker (Planned) Ian Chesser
Abstract Scope Grain boundary motion accommodates a variety of constraints during polycrystalline grain growth including boundary curvature and local strains generated by a mobile grain boundary network. In this work, we categorize a wide range of constrained grain boundary migration mechanisms via direct analysis of atomic displacement fields generated during clamped molecular dynamics bicrystal simulations and polycrystalline simulations in FCC Ni and BCC Fe. Although our taxonomy of constrained migration mechanisms supports existing models for grain boundary migration in special cases, several interesting examples call for more flexible models. Anisotropic mobility distributions from molecular dynamics simulations are reconciled with experimental data.

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Survey of Constrained Grain Boundary Migration Mechanisms
Advanced TEM of Interfaces and Defects in Functional Ceramics
Anisotropy at Interfaces in Rare-earth Pyrosilicates for High-temperature Coatings
Effect of Electrode Composition and Potential on Moisture Incorporation and Degradation in Dielectrics and Piezoelectrics
Electromigration-induced Defects' Evolution in Polycrystalline Interconnects: Insights from Phase-field Simulations
Equilibrium and Kinetic Shapes of Grains in Polycrystals
Grain Boundary Engineering ZnAl2O4 via Rare Earth (RE) Doping with Varying Ionic Radii
Implications of Ferroelectricity in Perovskite Solar Cells
Phase Stability of Sr1-xBaxMnO3 (0 ≤ x ≤ 0.5) Films Using Combinatorial Substrate Epitaxy
Relating Grain Size Distributions and Grain Boundary Excess Coverages to Complexion Transitions in Eu-doped MgAl2O4
The Impact of Metastable Grain Boundary States on Mobility in FCC Metal
Thermal Property of Diamond Thin Film on Si (100) Substrate
Vacancy-enhanced Grain Boundary Migration

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