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Meeting Materials Science & Technology 2020
Symposium Grain Boundaries, Interfaces, and Surfaces in Functional Materials: Fundamental Structure-Property-Performance Relationships
Presentation Title Electromigration-induced Defects' Evolution in Polycrystalline Interconnects: Insights from Phase-field Simulations
Author(s) William Farmer, Sree Shivani Vemulapalli, Kumar Ankit
On-Site Speaker (Planned) William Farmer
Abstract Scope Miniaturization of microdevices comes at the cost of increased circuit complexity and operating current densities. At large current densities electromigration leads to degradation of interconnects and solder, ultimately resulting in circuit failure. Although electromigration-induced defects in electronic materials can manifest in several forms, the formation of voids and channel-like slits can be commonly observed. This research aims at understanding the morphological evolution of voids and slits under electromigration by formulating a phase-field model that accounts for anisotropic mobility in the metallic interconnect. On the basis of an extensive parametric study, we report the conditions under which 'pancaking' of voids or the novel void 'swimming' regimes are observed. The simulated morphological evolution of slits propagating along grain boundaries is found to be strongly dependent on the grain size, atomic mobility and operating current density. Finally, inferences are drawn to formulate strategies using which the reliability of interconnects can be improved.
Proceedings Inclusion? Undecided


A Survey of Constrained Grain Boundary Migration Mechanisms
Advanced TEM of Interfaces and Defects in Functional Ceramics
Anisotropy at Interfaces in Rare-earth Pyrosilicates for High-temperature Coatings
Effect of Electrode Composition and Potential on Moisture Incorporation and Degradation in Dielectrics and Piezoelectrics
Electromigration-induced Defects' Evolution in Polycrystalline Interconnects: Insights from Phase-field Simulations
Equilibrium and Kinetic Shapes of Grains in Polycrystals
Grain Boundary Engineering ZnAl2O4 via Rare Earth (RE) Doping with Varying Ionic Radii
Implications of Ferroelectricity in Perovskite Solar Cells
Phase Stability of Sr1-xBaxMnO3 (0 ≤ x ≤ 0.5) Films Using Combinatorial Substrate Epitaxy
Relating Grain Size Distributions and Grain Boundary Excess Coverages to Complexion Transitions in Eu-doped MgAl2O4
The Impact of Metastable Grain Boundary States on Mobility in FCC Metal
Thermal Property of Diamond Thin Film on Si (100) Substrate
Vacancy-enhanced Grain Boundary Migration

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