|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Seeing is Believing -- Understanding Environmental Degradation and Mechanical Response Using Advanced Characterization Techniques: An SMD Symposium in Honor of Ian M. Robertson
||Creep and Fracture Characterization in the TEM Using Full-field Measurement Methods and Finite Element Analyses
||Yiguang Zhang, Shen Dillon, John Lambros
|On-Site Speaker (Planned)
In-situ full-field displacement measurements can better help validate material constitutive models at all length scales. However, limited work has been done characterizing displacements at the micro/nanoscale in the Transmission Electron Microscope (TEM). Here, digital image correlation (DIC) and particle tracking (PT) are applied to measure displacements during in-situ bending experiments of microbeams, either notched or un-notched, prepared by focused ion beam milling. Gold nanoparticles are deposited on the samples to serve as features for DIC and PT. Full-field quantitative deformation is then measured as a function of load from in-situ TEM images of the pattern evolution. To characterize creep behavior a constant load is applied and strain evolution is monitored. A 2D finite element simulation is performed to evaluate material property parameters using an inverse approach. Finally, notched specimens are then used to extract fracture characteristics by comparing numerical with experimental results from DIC and PT.
||Characterization, Mechanical Properties, Other