|About this Abstract
||2021 TMS Annual Meeting & Exhibition
||Characterization of Minerals, Metals and Materials 2021
||Insights into the formation of Al-Cu intermetallic compounds during the solid-liquid reaction by high-resolution transmission electron microscopy
||Jie Chen, Yongqiong Ren, Bingge Zhao
|On-Site Speaker (Planned)
During Al/Cu solid-liquid reaction, different intermetallic compound (IMCs) are expected, which can affect the mechanical and electrical properties of Al/Cu joints. To tackle this challenge, it is then necessary to tune the interface structure, which requires an insight into the formation mechanism of IMCs. In the current study, Al/Cu liquid-solid reaction was used to fabricate different IMCs. With the aid of focused ion beam (FIB) and high-resolution transmission electron microscopy (HRTEM), the orientation relationship between different IMCs and Cu was identified. Accordingly, the formation mechanism, especially the growth trajectory of Al/Cu IMCs, was addressed. This study provides fundamental understanding on the mechanism behind Al/Cu reaction, which may guide the performance improvement of Al/Cu dissimilar weld.
||Solidification, Phase Transformations, Characterization