|About this Abstract
||2021 TMS Annual Meeting & Exhibition
||Characterization of Minerals, Metals and Materials 2021
||Effect of Misorientation Development Near Grain and Twin Boundaries in Pure Copper and Copper-aluminium Alloy
||Sandhya Verma, Prita Pant, M P Gururajan
|On-Site Speaker (Planned)
Bulk deformation of polycrystalline materials show limitations imposed by the boundary due to requirements of compatibility across boundaries. Here, pure copper (Cu) having coarser twins and copper-8 wt.%-aluminium (Cu8Al) having finer twins are deformed to various strains and then misorientation and orientation gradient development near grain boundaries and twin boundaries is studied. The microstructure is procured using electron backscattered diffraction (EBSD) where misorientation development is explained by kernel average misorientation (KAM). We have shown the variation of misorientation development with boundaries. Misorientation development is also influenced by presence of nearby boundaries and triple junction. We have observed for Cu and Cu8Al that KAM values near boundaries does not behave monotonically. For Cu, it increases as well as decreases in values in one case, while in other case, it remains constant and for Cu8Al it reduces in values for most of cases and increases or remains constant sometimes with strain.