| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
High Performance Steels
|
| Presentation Title |
Modeling Creep Deformation in Diffusion Bonded 316H Stainless Steel Microstructure |
| Author(s) |
Sagar Bhatt, Mark Messner |
| On-Site Speaker (Planned) |
Sagar Bhatt |
| Abstract Scope |
Diffusion bonding has emerged as a highly effective technique for fabricating compact heat exchangers and for other joining applications. Although successful diffusion bonds have been demonstrated using various alloys, there is limited data available on successful diffusion bonding of alloys for elevated-temperature service, such as 316H stainless steel. In this work we model a polycrystal to mimic diffusion bonded microstructures and conduct creep deformation simulations at elevated temperatures using a MOOSE-based crystal plasticity finite element framework. By varying the number of cavities, area fraction and depth of grain growth across the interface we explore the influence of these factors on the long-term creep strength and ductility of the material. Our objective is to gain insights into the microstructural features and processing parameters that can potentially enhance the efficacy of the diffusion bonding process by improving the material's high temperature strength, thereby contributing to an improved understanding of this fabrication technique. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Modeling and Simulation, Mechanical Properties, Iron and Steel |