|About this Abstract
||2020 TMS Annual Meeting & Exhibition
||Innovations in High Entropy Alloys and Bulk Metallic Glasses: An SMD & FMD Symposium in Honor of Peter K. Liaw
||A Grain-growth-resistant High-entropy Alloy for Forging Applications
||Zhi Tang, Chuan Zhang, Oleg N. Senkov, Jonathan Poplawsky, Fan Zhang, Michael C. Gao, Peter K. Liaw
|On-Site Speaker (Planned)
We introduce a simple but breakthrough concept to achieve fine grains resistant to grain growth for the first time, demonstrated by three high-entropy alloys (HEA). Microstructures of the three HEAs are revealed by XRD, EBSD and APT to explain why the grain size of one alloy has 10 times finer than the other two alloys, and one order of magnitude slower grain growth at long term exposure at a near melting-point temperature. Similar published HEAs and other conventional alloys are summarized and compared for grain size and grain growth. Then a high throughput calculation by CALPHAD is applied to expand from three alloys to a new type of alloys with thousands of possibilities. The authors believe that this new type of alloy design concept can help the HEA community to find more applications in rings, disks, and forgings industry.
||Planned: Supplemental Proceedings volume