| About this Abstract |
| Meeting |
13th International Conference on the Technology of Plasticity (ICTP 2021)
|
| Symposium
|
13th International Conference on the Technology of Plasticity (ICTP 2021)
|
| Presentation Title |
A Hot Forming Method for Die Temperature Higher than Billet Temperature |
| Author(s) |
Lin Yuan, Fuchang Xu, Jinyu Li, Le Han, Debin Shan, Bin Guo |
| On-Site Speaker (Planned) |
Lin Yuan |
| Abstract Scope |
A thermoforming method is proposed to control the die temperature and billet temperature to make the die temperature higher than the billet temperature. The effectiveness of this method was verified by finite element simulation of the upsetting process and upsetting experiments of different alloys with different die temperatures, and compared with the actual upset. The aluminum alloy has a die temperature of 405°C, a billet temperature of 380°C, the press amount is 50%, and a high aspect ratio of 3.7 without instability. When the die temperature is higher than the billet temperature, it is beneficial to the material flow and heat conduction, thereby achieving the upsetting of the large height-diameter ratio, and improving the bulging phenomenon in the range of the ordinary upset height to diameter ratio. |
| Proceedings Inclusion? |
Definite: At-meeting proceedings |