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Meeting MS&T23: Materials Science & Technology
Symposium Advanced Coatings for Wear and Corrosion Protection
Presentation Title Surface Preparation and Process Optimization on Thin Film Coating to Reduce Wafer Warpage for Advanced Packaging Applications in Semiconductor Industry
Author(s) Amit Kumar
On-Site Speaker (Planned) Amit Kumar
Abstract Scope The recent advances in semiconductor devices, such as reduced form factor, low power consumption with better performance, arises from advanced packaging technology by stacking multiple layers of integrated circuits. There are several methods and associated challenges with such packaging technology which result in low yields, such as alignment and bonding, managing stress induced warpage, etc. To overcome some of these challenges, surface preparation and managing the coating led warpage is critical. Here, we will present some process strategies to address both the challenges. The process optimization of coatings is aimed at minimizing the overall stress on the wafer by managing the temperature, thickness, layer selection among other parameters.

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

Benefits of Yttria-doping in Ytterbium Disilicate Environmental Barrier Coatings
Ceramic Coating as a Diffusion Barrier to Prevent Saddle Marks in Continuous Homogenization of Aluminum 6000 Series
Corrosion-Resistant Coatings for Storage Canister
Development and Wear Behaviour of Compositional Gradient and Multi-layered Ni-W Alloy Coatings
Effect of Micro-arc Oxidation Voltage on the Morphology and Electrochemical Properties of AZ31B Magnesium Alloy
Effect of Sustainable Silica-rich Graphene Analogues to Achieve High-Performance Corrosion Resistance Coating for Carbon Steel
Effects of BN Content on the Microstructure and Mechanical Properties of Cr3C2–NiCr-BN Composite Coatings Prepared by a Novel Ethanol-fueled HVOF Process
Highly Robust CeO2/C3N4-modified NiP Electroless-plated Coatings
Improvement of Cutting Performance of Titanium Based Vacuum Brazed Diamond Tools Excursively Coating via Physical Vapor Deposition
J-1: Development of Fusion Bonded Epoxy Coatings on Steel Components for the Improved UV and Corrosion Resistance Performance
J-2: Obtaining Protective Coatings TiAl, TiSi under Conditions of Synthesis of Complex Functionally Active Charges
Novel Thermal Barrier Coatings Stable up to 1700C
Structural Integrity Assessment of Cold Spray Repaired High-Strength Aluminium Alloy 7075 Specimens
Surface Preparation and Process Optimization on Thin Film Coating to Reduce Wafer Warpage for Advanced Packaging Applications in Semiconductor Industry
Sustainable Development of Spray Parameters for Thermal Spray
The dDevelopment of Resistance Seam Cladding for Corrosion Resistant Liners in Linepipe
The Importance of Controlling UV Coating Temperature to Stabilize Viscosity during Application to Reduce Energy Consumption
Tribological and Anti-scaling Performance of Graphene-enriched Thin Polymer Coatings
ZnO-doped C3N4 Nanocapsules-modified NiP Metallic Coating

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