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Meeting MS&T21: Materials Science & Technology
Symposium Light Metal Technology
Presentation Title Now On-Demand Only - Diffusion Bonding of Aluminum by applying oscillating Pressure
Author(s) Martin Salge, Felix Gemse, Steffen Dahms
On-Site Speaker (Planned) Felix Gemse
Abstract Scope Stable oxide layers of lightweight materials like Aluminum- and Titanium based alloys are a major challenge for diffusion bonding, as it requires atomic contact between the materials to ensure grain boundary migration and grain growth across the initial interface. High quality surfaces which are needed for good joint properties are usually achieved by mechanical or chemical removing of oxides, thus requiring longer process times compared to other materials. We present a new approach to remove oxide layers in-situ by using an oscillating pressure for the bonding of AlMg3. The additional shear stresses induced into the oxide layers in combination with the elevated temperature lead to higher joint quality, joint strength and lower thermomechanical load during the bonding process, compared to statically bonded specimens. Therefore, joint qualities equal to “classic” diffusion bonding can be achieved at reduced process temperature, pressure and cycle time, increasing efficiency and productivity of the bonding process.


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