| About this Abstract |
| Meeting |
2021 TMS Annual Meeting & Exhibition
|
| Symposium
|
Computational and Modeling Challenges in Metals and Alloys for Extreme Environments
|
| Presentation Title |
Investigation of Role of Interface Microstructure on the Shock Compression and Spall Failure Behavior of Nanoscale Cu/Ta Multiphase Metallic Materials |
| Author(s) |
Marco Echeverria, Avinash Dongare |
| On-Site Speaker (Planned) |
Marco Echeverria |
| Abstract Scope |
The design of multiphase metallic materials for impact tolerant applications relies upon a fundamental understanding of the evolution of deformation-induced defects (e.g. dislocations and twins) and their transport through inhomogeneities. The role of interface microstructure (e.g. size, structure, distribution of interfaces) has become a vital topic to investigate due to the mechanisms of defect evolution and their interactions with interfaces to nucleate voids leading to spall failure. Large scale molecular dynamics simulations are carried out to investigate the shock-induced evolution of defects, specifically the twinning/detwinning behavior observed in these materials due to the presence of interfaces. The simulations comprise Cu/Ta multilayered alloys with imposed orientation relations at the interfaces, as well as microstructures with nanometric intermediate layers to mimic the clustering of Cu or Ta in their opposites. The links between void evolution and defect transport through interfaces and the subsequent spall failure are presented. |
| Proceedings Inclusion? |
Planned: |