| About this Abstract |
| Meeting |
MS&T22: Materials Science & Technology
|
| Symposium
|
Advances in Surface Engineering
|
| Presentation Title |
Control of Tin Coating Properties Using Pulse and Pulse Reverse Electrodeposition |
| Author(s) |
Holly Garich, Tim Hall, Brian Skinn, Danny Liu |
| On-Site Speaker (Planned) |
Holly Garich |
| Abstract Scope |
Use of tin coatings is industrially important in the fabrication of electronics, corrosion protection in automotive sectors and in lithium-ion batteries. The scalability of electrodeposition, in which metallic films are formed from application of an electric current, makes it an industrially important process. In the present work, use of pulse electrodeposition is used to control the properties of pure tin deposits for applications including printed circuit board fabrication and novel battery structures. Properties including stress, grain size, crystallographic texture and morphology are controlled through use of pulse and pulse reverse electrodeposition processes in simple methanesulfonic acid electrolytes. Thermal cycling and high temperature humidity storage tests have been conducted to assess the propensity for whisker formation in these tin deposits, and further, dense and uniform tin coatings covering high surface area copper substrates has been demonstrated for novel battery applications. |