| About this Abstract |
| Meeting |
MS&T22: Materials Science & Technology
|
| Symposium
|
Innovative Process Design and Processing for Advanced Structural Materials
|
| Presentation Title |
Mechanical Properties and Reliability of Nanolayered Stretchable Interconnect with Nanocrystalline Copper and Ternary Metallic Glass |
| Author(s) |
Gyeong-Seok Hwang, Eunji Song, Sohyeon Lee, Ju-Young Kim |
| On-Site Speaker (Planned) |
Gyeong-Seok Hwang |
| Abstract Scope |
In recent, research on stretchable electronics becomes active following the explosive commercialization of flexible electronics. There are several structures for stretchability, the ‘island and interconnect’ structure shows high performance with a simple structure and fabrication process. The conventional high conductive metals can be plastically deformed due to the small elastic deformation limit. It limits the stretchability of the whole stretchable device. Therefore, the development of material should be conducted to commercialize stretchable electronics.
Thus, we fabricated nanolaminates with copper and ternary metallic glass by using the sputtering process. The mechanical properties and reliability were measured through in-situ uni-axial tensile testing and the transfer method. Finally, the wireless communicative stretchable sensor was fabricated to demonstrate it for the stretchable electronics.
This work was supported by the National Research Foundation of Korea (NRF) grants funded by the Korean government (MSIT) (2020R1A5A6017701) and the Ministry of Trade, Industry and Energy (MOTIE, Korea) (20011735) |