Thin films enable advanced materials to operate in environments with extreme stresses and derive their material properties from their microstructure and morphology. Increasing control of thin film characteristics, by developing a fundamental understanding of growth mechanisms, expands both functionality and material property space. In this study, the effect of the sputtering plasma and target geometry on film microstructure is investigated. At a fixed working distance, the sputtering glow discharge properties were studied using a Langmuir Probe, as a function of the applied power and Argon gas pressure. The evolution of plasma properties including ion density, electron density, and electron temperature was observed. XRD and SEM characterization of the films deposited at the known plasma conditions reveal changes in texturing, morphology, and microstructure. The influence of plasma properties and cathode geometry on film growth mechanisms is analyzed to create a foundational understanding to design a wide array of sputtered microstructures.