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Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Solid State Diffusion Bonding of Metals and Alloys
Presentation Title Interfacial Recrystallization and Element Diffusion during the Hot Compression-bonding of Ti-6321 to TC4
Author(s) Bijun Xie, Mingyue Sun, Bin Xu, Dianzhong Li
On-Site Speaker (Planned) Mingyue Sun
Abstract Scope Conventional diffusion bonding method to manufacture aircraft components of titanium alloy may result in microstructure coarsening, long manufacture cycle and increased cost due to long bonding time. To avoid the disadvantages of diffusion bonding, the hot compression bonding was employed to join dissimilar titanium alloy. The results indicate that Ti-6321 alloy and TC4 alloy could be successfully bonded without micro-voids or precipitates along the bonding interface. Using electron backscattered diffraction technique, we found that obvious dynamic recrystallization grains appeared at the bonding interface, which is caused by discontinuous dynamic recrystallization. With increasing of strain, the area of interfacial recrystallization became wider and the original bond line disappeared completely. Besides, TEM results show that Mo and Nb enrichment appeared in the beta phase of TC4 side near the bonding interface, which indicates that Mo and Nb atoms diffused from Ti-6321 side to TC4 side through special diffusion channels.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

Anisotropic Grain Growth in Cu Joints at Low Temperatures by <111>-oriented Nanotwinned Copper Films
Bulk-state Reaction for Synthesizing Bulk Hybrid Alloys through High-pressure Torsion
Diffusion Bonding of AgC-Cu Bi-Layered Electrical Contacts
Diffusion Bonding of Ti-6Al-4V Alloy to Interstitial Free (IF) Steel Using Copper and Nickel Interlayers
Effect of Diffusion Bonding Parameters on Joint Efficiency of Fe- and Ni-base Alloys
Effect of Hydrogen Addition on the Diffusion Bonding Behavior of Titanium Alloys
Friction Stir Diffusion Bonding of Magnesium Alloy ZK 60 to Steel
Instant Copper Direct Bonding Using <111>-oriented Nanotwinned Cu Microbumps
Interfacial Recrystallization and Element Diffusion during the Hot Compression-bonding of Ti-6321 to TC4
Joining of 14YWT Ferritic ODS Alloys by Spark Plasma Technique
Mechanical Characterization of Diffusion Bonded Alloy 800H
Mechanical Performance of Diffusion Bonded 316 Stainless Steel for use in a Hybrid Compact Heat Exchanger
Microstructural Characterizations and Mechanical Properties of Diffusion Bonded Stainless Steel 316H and Inconel 800H
Microstructural Evolution and Mechanical Properties of Lap-jointed Ti-6Al-4V Plates by Pin-less Friction Stir Spot Welding
Microstructure Evolution and Mechanical Properties of Diffusion Bonded Ti6Al4V Alloy Joints for Aerospace Applications
Modeling Strength of Diffusion Bonded Interface Using Phase-Field Recrystallization and Creep-Damage Models.
MTI Low Force Friction Welding
Multi-Scale Study Of Bonding Mechanism Between Immiscible Mg/Steel Alloys
Optimization and Prediction of Bond Characteristics of Ti6Al4V Diffusion Bonded Joints through RSM
Solid-state Diffusion Bonding of Glass-metal for the International Thermonuclear Experimental Reactor (ITER) Diagnostic Windows
Solid State Diffusion Bonding of ODS Eurofer Steel by Spark Plasma Sintering
Solid State Joining of Dissimilar Ni-based Superalloys Using Field Assisted Sintering Technology
Tensile Performance of Diffusion Bonded Haynes 230 Alloy for use in a Compact Heat Exchanger
The Role of Interface Microstructure and Chemistry on the Bond Strength of Aluminum 6061 HIP-bonded Samples

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