|About this Abstract
||2020 TMS Annual Meeting & Exhibition
||Solid State Diffusion Bonding of Metals and Alloys
||Interfacial Recrystallization and Element Diffusion during the Hot Compression-bonding of Ti-6321 to TC4
||Bijun Xie, Mingyue Sun, Bin Xu, Dianzhong Li
|On-Site Speaker (Planned)
Conventional diffusion bonding method to manufacture aircraft components of titanium alloy may result in microstructure coarsening, long manufacture cycle and increased cost due to long bonding time. To avoid the disadvantages of diffusion bonding, the hot compression bonding was employed to join dissimilar titanium alloy. The results indicate that Ti-6321 alloy and TC4 alloy could be successfully bonded without micro-voids or precipitates along the bonding interface. Using electron backscattered diffraction technique, we found that obvious dynamic recrystallization grains appeared at the bonding interface, which is caused by discontinuous dynamic recrystallization. With increasing of strain, the area of interfacial recrystallization became wider and the original bond line disappeared completely. Besides, TEM results show that Mo and Nb enrichment appeared in the beta phase of TC4 side near the bonding interface, which indicates that Mo and Nb atoms diffused from Ti-6321 side to TC4 side through special diffusion channels.
||Planned: Supplemental Proceedings volume