|About this Abstract
||Materials Science & Technology 2020
||Sintering and Related Powder Processing Science and Technologies
||Novel Low-temperature Copper Sintering Paste for Large-area Die Attachment at 200 ℃ in Nitrogen Atmosphere
||Hao Zhang, Takanori Kobatake, Yasuyuki Akai, Minoru Ueshima, Katsuaki Suganuma
|On-Site Speaker (Planned)
In this study, we developed a new solvent and a modified sintering process which can generate reducing agent when heated for Cu sinter joining. With the help of its self-reduction ability, the prepared Cu paste could inhibit oxidation of Cu submicron particles and maintain stability at room temperature. It could realize Cu-Cu joints at 200 ℃ in nitrogen atmosphere within 30 min, and the shear strength is about 30MPa. Moreover, the sintered body of Cu paste shows a rather excellent microstructure with perfectly-maintained 3D shape and rarely-seen cracks. These results indicate that our novel Cu sintering paste has the ability to be used in the high-performance and high-reliability WBG applications, especially for the emergent requirement of large-area die attachment.