|About this Abstract
||2023 TMS Annual Meeting & Exhibition
||Additive Manufacturing and Innovative Powder/Wire Processing of Multifunctional Materials
||Rapid 3D Printing of AlN Ceramic Green Bodies for Heat Dissipation Devices
||Luyang Liu, Xiangfan Chen
|On-Site Speaker (Planned)
In this study, a new approach for fabricating green bodies of heat dissipation devices by using custom-made micro-continuous liquid interface printing (μCLIP) is presented. Aluminum nitride (AlN) ceramic with high thermal conductivity is selected as the functional material and poly (1,6-hexanediol diacrylate) is selected as the polymer matrix. With the resolution of 5.8 μm·pixel–1 and the printing speed of 10 μm·s–1, the μCLIP system can fabricate multi-scaled AlN green bodies efficiently. Characterization results show that the thermal conductivity of the green bodies increases as the concentration of AlN ceramic increases. Besides, the sophisticated 3D structures of the printed green bodies can be preserved after pressureless sintering. We believe that with an appropriate post heat treatment process, AlN based heat dissipation devices with customized, sophisticated 3D structures can be fabricated by this new approach.
||Additive Manufacturing, Other, Other