About this Abstract |
Meeting |
MS&T21: Materials Science & Technology
|
Symposium
|
Engineering Ceramics: Microstructure-Property-Performance Relations and Applications
|
Presentation Title |
Investigation and Fabrication of High Thermal Conductivity Silicon Nitride Ceramics |
Author(s) |
Hyun Min Lee, Jung Hoon Kong, Do-Kyung Kim |
On-Site Speaker (Planned) |
Do-Kyung Kim |
Abstract Scope |
Increasing demands for electronic devices has revealed the importance of a structural material based on its high performance. The high power consumption results in large thermal stresses, which can be overcome by the ceramic substrates with high thermal conductivity and high mechanical strength. The Si3N4 ceramics are the most promising materials for ceramic substrate due to their outstanding properties such as high electrical resistivity, good resistance to corrosive environments, etc. The thermal conductivity of Si3N4 ceramics is highly dependent on the types and amount of sintering additives, morphology of secondary phases, and microstructure. In this talk, we will introduce powerful strategies for fabricating a high thermal conductivity Si3N4 ceramic. The effects of sintering additives, raw powders, and phase transformation on thermomechanical properties will be discussed. Various sintering methods; pressure-assisted and pressureless sintering were conducted to suggest added benefits of versatility. |