About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
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Symposium
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Deformation and Damage Mechanisms of High Temperature Alloys
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Presentation Title |
Intra- and Intergranular Deformation Measurement in Polycrystalline Materials at High Temperature Using High-resolution Digital Image Correlation |
Author(s) |
Damien Texier, Julien Milanese, Eric Andrieu, Marie-Agathe Charpagne, Jean-Charles Stinville |
On-Site Speaker (Planned) |
Damien Texier |
Abstract Scope |
Capturing irreversible deformation in relation to the microstructure is critical to better understand the mechanical properties of polycrystalline materials. High Resolution-Digital Image Correlation (HR-DIC) has emerged as a quantitative and statistical tool to assess the heterogeneity of the deformation as the function of the microstructure. Tensile tests under controlled atmosphere were performed between room temperature and 650°C on two polycrystalline Ni-based superalloys: Alloy718 and René88DT. While similar slip activity was found to develop for both materials at room temperature, intergranular deformation with significant different activity was observed at elevated temperature between both materials. HR-DIC measurements successfully described slip-mediated grain boundary sliding for René88DT while intense strain localization near/at grain boundaries was observed in Alloy718 without the assistance of transgranular slip events. In addition, the intensity of the grain boundary sliding in Alloy718 was found sensitive to the applied strain rate and lead to premature intergranular cracking. |
Proceedings Inclusion? |
Planned: |
Keywords |
High-Temperature Materials, Mechanical Properties, Characterization |