About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
|
Symposium
|
Deformation and Damage Mechanisms of High Temperature Alloys
|
Presentation Title |
Phase Field Modeling of Void Growth under Creep |
Author(s) |
Tianle Cheng, Fei Xue, Jeffrey Hawk, Youhai Wen |
On-Site Speaker (Planned) |
Tianle Cheng |
Abstract Scope |
Creep damage and rupture is one of the major concerns for alloys applied at high temperatures. Void growth and coalescence are known to be the critical mechanisms for creep damage. In the literature, analytical or numerical models for void growth under creep often take strong assumptions for the shapes of voids and grains, or only consider one of the growth mechanisms (diffusion or plasticity). Here we develop a multi-phase-field model for void growth under creep that incorporates material microstructure, surface and GB diffusion, as well as crystal plasticity. Simulation results are compared to previous reports based on other methods such as the dilatational plasticity models, finite element models and analytical models. The influence of surface tension and surface diffusion on the void growth rate and morphology evolution under different triaxialities of remote stress are studied. The size effects on void growth under creep are discussed. |
Proceedings Inclusion? |
Planned: |