| About this Abstract |
| Meeting |
MS&T21: Materials Science & Technology
|
| Symposium
|
Powder Metallurgical Components in High Performance Applications
|
| Presentation Title |
Microstructural Uniformity duringSsintering, Thermal-plastic Processing and Recrystallization of Tungsten |
| Author(s) |
Lin Zhang, Xingyu Li, Xuanhui Qu |
| On-Site Speaker (Planned) |
Lin Zhang |
| Abstract Scope |
Tungsten (W) is applied as the key components for modern electronics and coating technology and other industries. Processing such a refractory metal at high-temperature conditions (sintering, thermal-plastic deformation and heat treatments), ubiquitously results in W having heterogeneous behaviors in densification, grain growth, plastically response and recrystallization, giving rise to a non-uniform microstructural evolution. Microstructural uniformity and the possible effect of impurities make it both challenging and fundamentally critical for understanding basic properties and applications. This work starts by presenting polycrystalline W with different purity, aiming to study the microstructural and mechanical evolution during sintering, hot-rolling and recrystallization, and the possible effect of contaminated impurities on them. Further, it provides a fully densified bulk W with uniform microstructure and ~200 nm grain size by a simple pressureless two-step sintering method. |