|About this Abstract
||2021 TMS Annual Meeting & Exhibition
||Thermal Property Characterization, Modeling, and Theory in Extreme Environments
||Thermal stability of metallic multilayers with triple junctions
||Tongjun Niu, Yifan Zhang, Jaehun Cho, Jin Li, Haiyan Wang, Xinghang Zhang
|On-Site Speaker (Planned)
Nanostructured metallic multilayers have attracted significant attention due to their high mechanical strength and superb radiation resistance. Here we compare the thermal stability of CuX/Fe multilayer with triphase triple junctions comparing to Cu/Fe multilayer. Annealing at elevated temperatures leads to the complete breakdown of layer structure and spheroidization of the Cu/Fe multilayer. In contrast, the structure of CuX/Fe multilayer remains stable after annealing with minor perturbations along layer interface. The mechanisms that lead to the enhanced thermal stability of CuX/Fe multilayer will be discussed. This study provides some insight on the design of stable metallic nanocomposites.
||Thin Films and Interfaces, Composites,