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Meeting 2021 TMS Annual Meeting & Exhibition
Symposium Thermal Property Characterization, Modeling, and Theory in Extreme Environments
Presentation Title Thermal stability of metallic multilayers with triple junctions
Author(s) Tongjun Niu, Yifan Zhang, Jaehun Cho, Jin Li, Haiyan Wang, Xinghang Zhang
On-Site Speaker (Planned) Tongjun Niu
Abstract Scope Nanostructured metallic multilayers have attracted significant attention due to their high mechanical strength and superb radiation resistance. Here we compare the thermal stability of CuX/Fe multilayer with triphase triple junctions comparing to Cu/Fe multilayer. Annealing at elevated temperatures leads to the complete breakdown of layer structure and spheroidization of the Cu/Fe multilayer. In contrast, the structure of CuX/Fe multilayer remains stable after annealing with minor perturbations along layer interface. The mechanisms that lead to the enhanced thermal stability of CuX/Fe multilayer will be discussed. This study provides some insight on the design of stable metallic nanocomposites.
Proceedings Inclusion? Planned:
Keywords Thin Films and Interfaces, Composites,


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