| About this Abstract |
| Meeting |
2021 TMS Annual Meeting & Exhibition
|
| Symposium
|
Thermal Property Characterization, Modeling, and Theory in Extreme Environments
|
| Presentation Title |
Thermal Stability of Metallic Multilayers with TripleJjunctions |
| Author(s) |
Tongjun Niu, Yifan Zhang, Jaehun Cho, Jin Li, Haiyan Wang, Xinghang Zhang |
| On-Site Speaker (Planned) |
Tongjun Niu |
| Abstract Scope |
Nanostructured metallic multilayers have attracted significant attention due to their high mechanical strength and superb radiation resistance. Here we compare the thermal stability of CuX/Fe multilayer with triphase triple junctions comparing to Cu/Fe multilayer. Annealing at elevated temperatures leads to the complete breakdown of layer structure and spheroidization of the Cu/Fe multilayer. In contrast, the structure of CuX/Fe multilayer remains stable after annealing with minor perturbations along layer interface. The mechanisms that lead to the enhanced thermal stability of CuX/Fe multilayer will be discussed. This study provides some insight on the design of stable metallic nanocomposites. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Thin Films and Interfaces, Composites, |