About this Abstract |
Meeting |
MS&T21: Materials Science & Technology
|
Symposium
|
Advances in Dielectric Materials and Electronic Devices
|
Presentation Title |
Direct-writing of Embedded Flexible Sensors for Strain and Temperature Monitoring for Stretchable Applications |
Author(s) |
Akshay Kakar, Derrick Banerjee, Edward M Sabolsky, Konstantinos A Sierros |
On-Site Speaker (Planned) |
Akshay Kakar |
Abstract Scope |
Flexible sensors have recently become popular in many applications ranging from soft robotics to wearable optoelectronics. Although various fabrication methods have been studied, the embedding of directly printed conductive inks remains largely unexplored. This is crucial for protecting against the environment and providing good adhesion with silicone. Additionally, silver offers a good balance between cost and electrical and thermal conductivity. In this study, we formulated silicone composite silver inks with varying compositions of binder, solvent, dispersant, and surfactant. These inks were evaluated based on their viscosity, surface tension, and electrical conductivity. The optimum composition was then used for embedding flexible sensors in silicone. The direct ink writing method was used to lay the bottom layer of silicone, followed by direct-writing the strain gauge and thermomechanical sensor designs. The sensors were then embedded under the second layer of silicone. The efficacy of these sensors was evaluated based on their electromechanical performance. |