About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
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Printed Electronics and Additive Manufacturing: Functional Materials, Processing Techniques, and Emerging Applications
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Presentation Title |
Evaluating the Electrical Properties of Thermally Decomposed Binders via Terahertz Time-Domain Spectroscopy for Direct Ink Writing of Flexible Electronics |
Author(s) |
Harrison Loh, Alan Bristow, Konstantinos Sierros |
On-Site Speaker (Planned) |
Harrison Loh |
Abstract Scope |
During the formulation of printable inks for DIW, polymers are frequently added as particle stabilizers or rheological modifiers. Thermal treatments are often needed for decomposing these additives, although complete removal can require temperatures above the working threshold of flexible substrates. While DIW benefits from quick prototype design modifications and flexible fabrication conditions, one limitation compared to chemical or physical material growth is the disconnect between nanoparticles/2D nanomaterials added to inks for printing functional structures (e.g. conductive circuits), requiring critical volume loadings to achieve percolative pathways. This challenges may be addressed with incomplete decomposition of polymers, which has been cited to produce conductive residues, reducing thermal treatment requirements and enhancing conductive bridging between particles. In this work, THz spectroscopy is used to analyze the carrier dynamics of polymers subjected to thermal treatments, with the aim of exploring the potential of enhancing the performance of printed inks using conductive residue. |
Proceedings Inclusion? |
Planned: |
Keywords |
Additive Manufacturing, Electronic Materials, |