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Meeting 2023 TMS Annual Meeting & Exhibition
Symposium 2023 Technical Division Student Poster Contest
Presentation Title SPG-58: Thermal Stability of Novel Multicomponent Al-based High-performance Alloys and Its Direct Implication on Their Mechanical Properties
Author(s) Gourav Mundhra, Hao-En Peng, Jien-Wei Yeh, B. S. Murty
On-Site Speaker (Planned) Gourav Mundhra
Abstract Scope There is a never-ending quest for lightweight metallic materials in transportation. Al-based alloys suffer from abysmal softening resistance at high temperatures (HT). Here, we present a striking advance in the understanding of thermal stability and its direct implication on the mechanical properties of novel Al-based nanoalloys. X-Ray Diffraction (XRD), Scanning Electron Microscopy (SEM), advanced scanning/transmission electron microscopy (S/TEM) revealed that the microstructure of these alloys is exceptionally stable even after prolonged exposure of 240 hrs. at temperatures ranging from 400 to 600 ℃, i.e., 72% to 94% of the melting point of Al. Room temperature nanoindentation tests revealed exceptional retention in nanomechanical properties even after prolonged HT exposure. Bending tests and fractographic analysis after prolonged thermal exposure revealed that our ultra-strong alloys were deformable and exhibited a ductile failure mechanism. These newly developed lightweight alloys have the potential for aerospace applications requiring materials with superior structural stability and mechanical endurance.
Proceedings Inclusion? Undecided
Keywords Aluminum, High-Temperature Materials, Mechanical Properties


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