|This symposium will address materials issues related to electronics assembly and packaging, including lead-free solders, nano particles sintering, and other materials. Soldering processes, sintering processes, metallization, and manufacturing aspects will also be addressed. Materials development for use in optical/Optoelectronic and MEMS packagings are also included. Topics considered will consist of materials and manufacturing challenges in solder alloy design, structure-property-processing relationships of bulk solders and solder joints, influence of surface and underbump metallization on solderability and reliability of solder joints, microstructure modeling and control, reliability modeling, and testing methodologies of various kinds of electronic packages. Thermal interface materials (TIMs) and low temperature solders (LTSs) are of increasing importance in recent years and will be especially welcome.