| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Microstructures of Ag-In transient liquid phase bonding using In-coated Ag sheet |
| Author(s) |
Xunda Liu, Hiroaki Tatsumi, Zhi Jin, Hiroshi Nishikawa |
| On-Site Speaker (Planned) |
Hiroshi Nishikawa |
| Abstract Scope |
The third generation semiconductors, such as SiC and GaN, are being developed as promising replacements for Si-based semiconductors. To use these semiconductors, the high-temperature bonding process is one of the key technologies. Recently, transient liquid phase (TLP) bonding has been regarded as one of possible solutions for such high temperature process. In this study, a feasibility study has been conducted to determine whether Ag-In sandwich sheet can be used for bonding two Ag-plated Cu disks. The shear strength of the sample bonded at 225 ℃ for was evaluated. It was found that after 5 min bonding, the upper disk bonded well with the lower disk, with a shear strength around 15 MPa. This strength increased to around 20 and 30 MPa after 10 and 30 min bonding. It could be concluded that the Ag plated Cu disk was successfully bonded by Ag-In sandwich structure with significantly shortened bonding time. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Process Technology, |