|About this Abstract
||2020 TMS Annual Meeting & Exhibition
||Alloys and Compounds for Thermoelectric and Solar Cell Applications VIII
||Assessment of Interface in Bi2Te3 and Sb2Te3 Thin Film Thermoelectric Modules
||Zhen-Wei Sun, Kai-Wen Cheng, Albert T. Wu
|On-Site Speaker (Planned)
Two-dimensional structural thin film thermoelectric module attracts interests due to its wide applications on different configuration of heat sources and have high flexibility of the material selection for substrates. Bismuth telluride and antimony telluride (Bi2Te3 and Sb2Te3) are promising thermoelectric (TE) materials due to their intrinsic small band gap (approximately 0.2 eV) and excellent zT values at operating temperatures. However, the transition efficiency drastically reduces after assembling as modules. Cu is usually selected as the material for electrode. However, it is not clear if the reaction between Cu and Te would affect the thermoelectric properties. In this study, a diffusion barrier is sputtered between the electrodes and the thermoelectric thin films. The module is aged to simulate the operating conditions for different duration of times. The interfacial morphology and the composition of the interaction layers are investigated. The stability of the interface and its effect on thermoelectric properties are assessed.
||Planned: Supplemental Proceedings volume