About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Additive Manufacturing Materials, Processes and Applications for Energy Industry
|
| Presentation Title |
Bonding Characteristics at the Copper/Inconel Interface: A Comparison of Fusion and Non-Fusion Additive Manufacturing Techniques |
| Author(s) |
Shirin Dehgahi, Hyunjong Lee, Magesh Kumaravel, Ehsan Marzban Shirkharkolaei, Abhishek Singh, Sara Bagherifard, Davoud Jafari |
| On-Site Speaker (Planned) |
Shirin Dehgahi |
| Abstract Scope |
The demand for multi-material structures integrating distinct alloys within a single component is rising due to the need for location-specific properties and enhanced performance. Fusion-based additive manufacturing methods such as laser powder bed fusion (LPBF) and directed energy deposition (DED) have been widely explored, showing promising results. In contrast, Cold Spray Additive Manufacturing (CSAM), a solid-state process, has received limited attention for multi-material applications. This work investigates the relationship between grain size, interface composition, and thermal properties in copper/Inconel joints fabricated by CSAM and LPBF to understand how interfacial microstructure influences bonding and thermal performance in thermal management systems. Specifically, interfacial microstructure, porosity, hardness, and thermal conductivity of Inconel 718/GrCop-42 joints are examined. LPBF samples showed diffusion zones indicative of metallurgical bonding, while CSAM samples exhibited sharp, diffusion-free interfaces characteristic of solid-state bonding. Thermal conductivity correlated closely with microstructural features, offering insights for optimizing hybrid metal structures. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Mechanical Properties, Solidification |