|About this Abstract
||2023 TMS Annual Meeting & Exhibition
||Advanced Real Time Imaging
||4D Microstructural Evolution of Bismuth (Bi) Phase during Solidification of Sn-58Bi Solder
||Amey Luktuke, Hamid Torbati-Sarraf, Sridhar Niverty, Alan Kastengren, Viktor Nikitin, Aniket Tekawade, Rajkumar Kettimuthu, Nikhilesh Chawla
|On-Site Speaker (Planned)
With increased interest in Heterogeneous Integration Packaging (HIP), Sn-58Bi (MP:139˚C) is being investigated to replace Sn-Pb and SAC solder alloys due to its significantly lower melting point. The Bi phase plays a crucial role in determining the mechanical behavior and reliability of Sn-58Bi solder joints. Our recent work showed the growth of Bi phase in pyramidal morphology during the solidification process. In this study, we investigate the mechanisms governing the evolution of solidification of the Bi phase in Sn-58Bi solder using 4D microtomography and the Energy Dispersive Diffraction (EDD) technique. The microtomography analysis revealed the mechanisms controlling the growth dynamics, while the EDD investigation provided crystallographic insights into the evolution process. The combination of these techniques presented a unique understanding of Bi crystal growth in the solder melt which will be discussed.
||Characterization, Solidification, Electronic Materials