| About this Abstract |
| Meeting |
Materials Science & Technology 2020
|
| Symposium
|
Joining and Integration of Advanced and Specialty Materials
|
| Presentation Title |
Controlling the Formation of Intermetallic Compounds in TLP Joining of Grade-2 Titanium Alloy |
| Author(s) |
AHM Esfakur Esfakur Rahman |
| On-Site Speaker (Planned) |
AHM Esfakur Esfakur Rahman |
| Abstract Scope |
Transient Liquid Phase (TLP) bonding is primarily a solid-state diffusion joining process. The joining temperature is below the melting point of parent alloys while higher than the melting point of interlayer materials. As a result, there is no heat affected zones (HAZ) in TLP bonded joints. However, interlayer materials forms intermetallics almost all the times in the microstructure of the joint area. If not controlled properly, these intermetallics becomes detrimental and reduces the strength of the joint significantly. This research focuses how the formation of intermetallics and their distribution in the microstructure can be controlled. The interlayer used was 99.99% pure Copper (Cu) foil. The joining temperature, time, interlayer thickness, and roughness of the faying surfaces were optimized to obtain the best possible microstructures. SEM images and point EDS were used to investigate the microstructure and chemical composition of the bonded area. |