About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Thin Films and Coatings: Properties, Processing and Applications
|
| Presentation Title |
Ti3SiC2 Electrode Films Fabricated by Aerosol Deposition for Integration Into MIM Capacitor Structures |
| Author(s) |
Hyeong-Seok Oh, Jun-Woo Lee, Yuan-Bo Zhang, Sun-Woo Jang, Min-Ju Cho, Taek-Kyun Kim, Jong Ho Won, Kanghee Won, Sang-Mo Koo, Weon Ho Shin, Oh Jong-Min |
| On-Site Speaker (Planned) |
Hyeong-Seok Oh |
| Abstract Scope |
Conventional metal electrodes, such as Ni and Cu, suffer from poor oxidation resistance at high temperatures, limiting the long-term reliability of electronic devices. As a promising alternative, Ti3SiC2 (TSC) —a MAX-phase material—offers high electrical conductivity, oxidation resistance, and thermal stability due to its unique combination of metallic and ceramic properties. While TSC films have been fabricated using traditional deposition methods requiring high temperatures and vacuum conditions, these approaches often lead to long processing times and possible phase changes. Aerosol deposition (AD), a room-temperature process, enables rapid formation of dense ceramic films under low vacuum conditions. Although a few studies have reported AD-based TSC films, their electrical properties remain largely unexplored. In this study, TSC films were fabricated via AD and analyzed to investigate the relationship between microstructure and resistivity. Furthermore, fully AD-fabricated MIM capacitor structures were constructed to evaluate the applicability of TSC films as electrodes. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Ceramics, Electronic Materials, Thin Films and Interfaces |