About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
External Field-Intensified Materials Processing
|
| Presentation Title |
Surface Crack Healing in Ni-Based GH4169 Alloy Under Pulsed Current |
| Author(s) |
Fuqian Yang |
| On-Site Speaker (Planned) |
Fuqian Yang |
| Abstract Scope |
Healing structural flaws/damages can improve the structural durability of materials and prolong the lifetime of associated mechanical structures and systems. In this work, the feasibility of healing surface cracks in Ni-based GH4169 alloy was demonstrated under the concurrent action of pulsed current and compression. A surface crack was completely healed in ~3.5 s under an electric pulse of ~2.5 V in voltage, 25 ms in pulse width, and 20 Hz in frequency and a compressive load of 500 N. Prior to the complete healing of the crack, the crack size decreases nearly linearly with the healing time. There exists a current-influential zone with finer grains, which can be likely attributed to the “crystallization” of local molten zone during fast cooling. A model was developed for the analysis of the distribution of temperature around a crack.
This work is supported by the NSF through DMR-2409132. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Copper / Nickel / Cobalt, Modeling and Simulation, |