About this Abstract |
Meeting |
MS&T24: Materials Science & Technology
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Symposium
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High Entropy Materials: Concentrated Solid Solutions, Intermetallics, Ceramics, Functional Materials and Beyond V
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Presentation Title |
Unveiling of Strengthening Mechanisms by Cu-Added High-Entropy Alloy Fillers in Metastable Ferrous Medium-Entropy Alloy Welding |
Author(s) |
Lee Yoona, Seonghoon Yoo, Namhyun Kang |
On-Site Speaker (Planned) |
Lee Yoona |
Abstract Scope |
This study evaluated the weldability of metastable ferrous medium-entropy alloy using high-entropy alloy fillers having various Cu contents, followed by discovering solidification and strengthening mechanisms focusing on the formation of Cu-rich phase (FCC2) in weld metal (WM). The WM with higher Cu exhibited more dual face-centered cubic (FCC) phases with dendrite-shaped compositional heterogeneity through phase separation by higher mixing enthalpy, leading to excellent tensile properties at room and cryogenic temperatures. This enhancement resulted from the synergic effect of solid-solution and grain-boundary hardenings. More interestingly, this WM improved cryogenic tensile strength. The decreased SFE of Cu-lean FCC1, due to consumption of solute Cu for forming FCC2, activated twin formation, while FCC2 having the high SFE refined secondary twins and acted as an additional dislocation accumulation. This study suggests that the formation of FCC2 could enhance tensile properties at both room and cryogenic temperatures. |