About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Ultrafine-grained and Heterostructured Materials (UFGH XI)
|
| Presentation Title |
Effect of High-pressure Torsion on a Few Mechanical and Electrical Behaviors of Commercially Pure Cu |
| Author(s) |
Praveen Kumar, Ajay Rijal, Shobhit P Singh, Jae-Kyung Han, Megumi Kawasaki |
| On-Site Speaker (Planned) |
Praveen Kumar |
| Abstract Scope |
Cu being a key element in various electronics devices, that undergo cyclic mechanical loading, requires optimum combination of mechanical and electrical properties. Commercially pure Cu is processed through high-pressure torsion (HPT) at 6 GPa up to 50 turns. The effect of HPT on microhardness, resistivity, and fatigue was evaluated and correlated with microstructure. It is observed that HPT process produced ultra-fine grains as low as ~300 nm. Low-angle boundaries and twins boundaries formed at onset of straining that transformed into high grain boundaries on further straining. Microhardness enhanced by ~240%, whereas increment in resistivity was about ~27% as compared to annealed Cu. Furthermore, HPT processed Cu samples showed lesser fraction of persistent slip-bands in the initial stages of fatigue testing and appears to enhance fatigue life. An overview of the observed properties, based on correlation with microstructure conducted using electron back-scattered diffraction and transmission electron microscopy, will be presented |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume; Planned: Supplemental Proceedings volume |