| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Nanostructured Materials in Extreme Environments II
|
| Presentation Title |
Evolution of Thermally Stable CuTa Nanocrystalline Alloys |
| Author(s) |
Billy Chad Hornbuckle, Anthony Roberts, Anit Giri, Sean Fudger, Tom Luckenbaugh, Chris Marvel, Kiran Solanki, Kris Darling |
| On-Site Speaker (Planned) |
Billy Chad Hornbuckle |
| Abstract Scope |
Here, we present the discovery of a newly ordered structure in a bulk nanocrystalline copper-based ternary system that enables copper-based alloys to be operated at near-melting temperatures. Analyzed by aberration-corrected scanning transmission electron microscopy (STEM), atom probe tomography, and density-functional theory (DFT) analysis, we present the formation of a new ordered, sub-5 nm, coherent structure of Cu-Li. The atomic bi-layers of Ta create an interface providing new strengthening mechanisms for an unprecedented thermally stable microstructure in an alloy of Cu-3Ta-0.5Li. Moreover, despite being exposed to 800˚C, 0.8TM for ~10,000 hours, the alloy only experienced a 3% decrease in yield strength. The incurred grain growth was only 36 nm or the equivalent distance of one lattice parameter in Cu (0.362 nm) every 100 hours. The results of this work have significant consequences as they will enable highly conductive and convective copper-based alloys to finally be used in various high-temperature applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
High-Temperature Materials, Characterization, Powder Materials |