| About this Abstract |
| Meeting |
2023 TMS Annual Meeting & Exhibition
|
| Symposium
|
Additive Manufacturing and Innovative Powder/Wire Processing of Multifunctional Materials
|
| Presentation Title |
3D Ink-extrusion Printing and Sintering of Thermoelectric Yb14MnSb11 |
| Author(s) |
Ming Chen, Alexander Proschel, Araseli Cortez, Jeffrey G Snyder , David Dunand |
| On-Site Speaker (Planned) |
Ming Chen |
| Abstract Scope |
Yb14MnSb11 is a high-performance, high-temperature thermoelectric (TE) material, but its brittleness and poor formability prevents manufacturing of TE devices with complex geometries. For Yb14MnSb11, traditional additive manufacturing approaches based on laser melting/sintering induce cracking and evaporation of Mn and Sb, due to high temperatures and thermal gradients. Here, we apply 3D ink-extrusion printing technique to fabricate Yb14MnSb11, enabling complex geometries with high fill factor and aspect ratio footprint to maximize heat transfer and conversion. Precursor powders are suspended together with binder into an ink with sufficiently low viscosity that it can be 3D-extruded into thin struts, in air at ambient temperature. Printed green body is sintered at elevated temperatures to decompose binder and densify powders. We discuss various approaches to achieve high density and high purity Yb14MnSb11 during the sintering process (including transient liquid phase sintering with Sb-rich melts), we describe the resulting microstructures and we report on TE properties. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Sustainability, Process Technology |