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Meeting 2021 TMS Annual Meeting & Exhibition
Symposium Advances in Biomaterials for 3D Printing of Scaffolds and Tissues
Sponsorship
Organizer(s) Changxue Xu, Texas Tech University
Yifei Jin, University of Nevada, Reno
Zhengyi Zhang, Huazhong University of Science and Engineering
Jun Yin, Zhejiang University
Scope Biomaterials have been widely utilized in a variety of biomedical applications, such as tissue engineering, regenerative medicine, biosensors and medical implants, due to their inherent physical and chemical properties including biocompatibility, tunable mechanical properties and biodegradability, and hierarchical internal structures. Additive manufacturing, based on layer-by-layer fabrication mechanism, possesses critical advantages in fabrication of 3D structures of biomaterials for various biomedical applications, including complex geometries, heterogeneity, porosities, and incorporation of different growth factors. Typical 3D printing techniques used for biomaterials include inkjet printing, microextrusion, laser-assisted printing, stereolithography, to name a few. The most common biomaterials used in 3D printing are ceramics, polymers, and composites. The post-printing properties and microstructures are of great importance to the biomaterial functionality, such as mechanical properties, physical properties including swelling and degradation properties, pore size and porosity. The symposium shall focus on the recent advances in the biomaterials for 3D printing of scaffolds and tissues. Specific topics of interest include, but are not limited to:

• Design, fabrication and characterization of 3D tissue-engineered scaffolds
• Characterization of post-printing properties of biomaterials
• Modeling and simulation of biomaterial properties
• Fabrication of biomaterials-based heterogeneous structures
• Novel biomaterials and 3D printing techniques for scaffold fabrication
• Bioprinting of cellular structures and tissues
• Cell-biomaterial interaction
• Bioink rheological properties and printability
• Organ-on-chips
Abstracts Due 07/15/2020
Proceedings Plan Planned: Collected volume in which your symposium’s papers would be included with other symposia (indicate title in comments section below)
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