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Meeting Materials Science & Technology 2020
Symposium Bulk and Sheet Thermal-Deformation Processing and Microstructure Development in Metals – Characterization, Experiments and Modeling
Sponsorship TMS Shaping and Forming Committee
Organizer(s) Daniel R. Coughlin, United States Steel Corp
Kester D. Clarke, Colorado School of Mines
Piyush Upadhyay, Pacific Northwest National Laboratory
Scope Recent advances in alloy design methods and microstructural development during processing have produced metals that demonstrate previously unattainable combinations of properties. Many of these new alloys also exhibit novel temperature and strain path-dependent behavior. The main objective of this symposium is to provide a scientific forum that highlights the numerous advances in characterization, experiments, and computation that improve our knowledge of mechanical and metallurgical responses of advanced metallic alloys relevant to manufacturing. This includes increasing our understanding of the relationships between complex microstructures and thermal-deformation paths with mechanical response, formability, and failure. Abstracts are requested in the following general topic areas: mechanical property measurement methods; characterization of phase transformations, deformation mechanisms, texture, etc.; deformation simulations, including in-situ studies; advanced manufacturing processes; integration of science and manufacturing; and the development of accurate constitutive relationships.
Abstracts Due 05/31/2020
Proceedings Plan Undecided

Austenite Stability and Strain Localization in Q&P Steels Deformed at Dynamic Strain Rates
Characterisation of static recrystallisation and grain growth in designed gradient microstructures: a pathway to high-throughput microstructural testing?
Continuum Dislocation Dynamics-based Modeling of the Strain Hardening Behavior of ECAPed Aluminum Alloy
Microstructure and Mechanical Properties of Diffusion Bonded IN740H
Probing Differences in Processing and Texture in FCC/BCC Nanolaminates Fabricated via Accumulative Roll Bonding

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