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Meeting Materials Science & Technology 2020
Symposium Bulk and Sheet Thermal-Deformation Processing and Microstructure Development in Metals – Characterization, Experiments and Modeling
Presentation Title Microstructure and Mechanical Properties of Diffusion Bonded IN740H
Author(s) Kaimiao Liu, Tao Liu, Omer N Dogan
On-Site Speaker (Planned) Kaimiao Liu
Abstract Scope Diffusion bonding is an important joining technique for compact heat exchangers used in supercritical CO2 (sCO2) power cycles. IN740H is one of the recently developed nickel superalloys used in extreme environment applications. There is a desire to use this alloy in compact heat exchangers to increase efficiency of sCO2 power cycles. Microstructure and mechanical properties of diffusion bonded IN740H have been studied. The detailed SEM and TEM results showed formation of (Nb, Ti)C at the bond line mainly driven by increased strain at the mating surfaces. Failure of the lap shear specimens occurred in the parent material suggesting diffusion bonding is a reliable technique to join thin IN740H sheets.
Proceedings Inclusion? Undecided

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

Austenite Stability and Strain Localization in Q&P Steels Deformed at Dynamic Strain Rates
Characterisation of static recrystallisation and grain growth in designed gradient microstructures: a pathway to high-throughput microstructural testing?
Continuum Dislocation Dynamics-based Modeling of the Strain Hardening Behavior of ECAPed Aluminum Alloy
Microstructure and Mechanical Properties of Diffusion Bonded IN740H
Probing Differences in Processing and Texture in FCC/BCC Nanolaminates Fabricated via Accumulative Roll Bonding

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